Board Circuit PCB kaku
| Pesanan Qty. | Produksi masal | Produksi sampel | |
| Jumlah lapisan | 2~ 32L | 48L | |
| Max.Ketebalan PCB | 12mm (472 mil) | 12mm (472mil) | |
| Min.Lebar/Rohang | Lapisan jero | 2,5 jt/2,5 jt | 2,2 mil / 2,2 mil |
| Lapisan luar | 3 jt/3 jt | 2,8 jt/2,8 jt | |
| Max.Ketebalan tambaga | 6 Oz | 30 Oz | |
| Min.Diaméterna liang bor | liang mékanis | 0,15 mm (6 mil) | 0,1 mm (4 mil) |
| liang laser | 0,1 mm (4 mil) | 0,075 mm (3 mil) | |
| Max.Ukuran (Ukuran Finish) | Lapisan tunggal sareng dua sisi | 1150mmX500mm | 1250mmX550mm |
| Multilayer | / | 1250mmX570mm | |
| Rasio Aspék (Liang Finish) | 10:01:00 | 16:01:00 | |
| Bahan | FR4 | S1000-2, IT180A, IT158, S1000 / S1155, KB6167 | |
| Frékuénsi Luhur | Ro3003, Ro3006, Ro4350B, Ro4360G2, Ro4835, Ro5880 | ||
| Lain | Alu. basis, Cu basis jsb. | ||
| Surface Finish | HASL, ENIG, Immersion Tin, OSP, Immersion Silver,Electroplating Emas Keras/Emas Lemes, Ramo Emas, OSP selektif, ENEPIG. | ||
| Heavy CopperPCB | Max.Ketebalan tambaga | 6 Oz | 30 Oz |
| HDI PCB | Struktur | Sakur Lapisan (10L) | Sakur Lapisan (10L) |
| Lebar/Ruang (Lapisan Luar) | 2,5 juta / 2,5 juta | 2 jt/2 jt | |
| Rasio Aspék (Blind Hole) | 1:01:00 | 1:01:00 | |